Integrated modular data center construction will bring capacity online at speed to meet growing global demand for AI and cloud computing.
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Shell is turning down the heat and turning up the performance in data centers with the launch of Shell DLC Fluid S3 — a cutting-edge Direct Liquid Cooling (DLC) solution designed to meet the demands of high-performance computing and Artificial Intelligence (AI).
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High-density, direct-to-chip liquid cooling platform offers extended cooling capacity via modular, skidded design and pay-as-you-grow approach.
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Now available in EMEA, the expanded Vertiv CoolChip CDU family supports any stage of liquid cooling adoption.
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Local power generation system designed to deliver an additional 61 megawatts of electricity to...
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The latest BCS Breakfast Club meeting was held in collaboration with Hyphen, the international...
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Ecolab’s new innovation, 3D TRASAR™ Technology for Direct-to-Chip Liquid Cooling, protects...
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As a member of the EUDCA Technical Committee, with its experience and expertise in Lifecycle...
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Introduces low-GWP R454C refrigerant in its CyberAir 3PRO DX GE4(S) range.
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Vertiv™ PowerSwitch 7000 enables high-availability power architectures for data centres,...
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Eclipse Power Networks to adopt and maintain mission-critical power infrastructure for new...
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As part of its campaign to address the ongoing skills shortage in the data centre and IT industry,...
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Eaton has launched the 9PX Gen2 5-11kW UPS a new product that adds benefits to its proven 9PX...
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AI-driven data center management software releases stranded cooling capacity, removes power &...
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Pfannenberg has introduced the DHS Hybrid Series (DHS 34X1).
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