JETCOOL Technologies develop 'more efficient' cooling

ETCOOL Technologies has been selected to receive up to $1,265,747 in funding from the U.S. Department of Energy Advanced Research Projects Agency-Energy (ARPA-E).

The funding is part of the ARPA-E Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) program, which aims to develop high-performance, energy efficient cooling solutions for data centers.

Used to house computers, storage systems, and computing infrastructure, data centers account for approximately 2% of total U.S. electricity consumption while data center cooling can account for up to 40% of data center energy usage overall. By utilizing JetCool's patented microconvective cooling® technology, the energy and cost associated with cooling data centers can be significantly reduced. This technology can help save 11.1 billion kilowatt-hours of electricity and 150 billion liters of water per year, while also preventing 35 million metric tons of CO2 emissions around the world through widespread deployment.

"We are thrilled to receive this award from ARPA-E," said JetCool's CEO, Dr. Bernie Malouin. "It is a testament to our team's hard work and dedication in developing innovative cooling technologies that can reduce energy consumption in data centers while also reducing their carbon footprint. We are excited to continue our work with ARPA-E and look forward to making a positive impact on the data center industry."

JetCool’s selection for DOE's COOLERCHIPS program is a significant milestone for the company and demonstrates its commitment to become an industry leader in liquid cooling solutions for data centers. Led by Dr. Ludwig Haber, JetCool's engineering team is comprised of experts in the fields of mechanical and thermal engineering. The team will work to develop energy-efficient, cost-effective liquid cooling solutions to improve the reliability and performance of servers in data centers, reducing downtime and maintenance costs.

Four air conditioning units replaced across two rooms in complex logistics operation.
The European Data Centre Association (EUDCA) has released an extensive survey of Europe’s data...
Siemens, Cadolto and Legrand introduce new modular data centre.
Shell is turning down the heat and turning up the performance in data centers with the launch of...
High-density, direct-to-chip liquid cooling platform offers extended cooling capacity via modular,...
Now available in EMEA, the expanded Vertiv CoolChip CDU family supports any stage of liquid cooling...
Integrated modular data center construction will bring capacity online at speed to meet growing...
Local power generation system designed to deliver an additional 61 megawatts of electricity to...